Anti-static shielding bag

Anti-static Shielding Bag for PCB, IC and ESD-Sensitive Electronics

Tongxi anti-static shielding bags, also known as ESD shielding bags or static shielding bags, are designed for packaging PCB, PCBA, IC, LED, LCD, semiconductor components and other ESD-sensitive electronic products during handling, storage and transportation.

The bag uses a multilayer structure consisting of an antistatic PET outer layer, vacuum-deposited aluminum shielding layer, and antistatic PP or PE inner layer. The metallized layer provides electrostatic shielding around the packaged component, while the antistatic inner and outer surfaces help control charge accumulation during handling.

Standard thicknesses are 75 μm and 100 μm. Size, thickness, surface resistance, closure, bag structure and printing can be customized according to the electronic component and packaging process.

MOQ: 500 pcs | Lead Time: 10–18 Days

Anti-static Shielding Bag Specifications

75 μm or 100 μm: Which Shielding Bag Thickness Should You Choose?

The thicker option is not automatically the correct option. Select film thickness according to component weight, bag dimensions, handling frequency and the mechanical conditions expected during storage and transportation.

Choose the Bag Style for Your Packaging Process

Select the closure and bag structure according to whether the product will be permanently sealed, repeatedly accessed or packed manually on the production line.

Choose Anti-static Shielding Bags by Application

PCB and PCBA Packaging

For bare PCB and assembled circuit boards, select the bag according to board dimensions, maximum component height, exposed corners, total weight, handling frequency and sealing method.

A 75 μm shielding bag is suitable for many standard PCB packaging applications. Consider 100 μm for larger or heavier assemblies, frequent handling or transportation conditions requiring additional mechanical durability.

Choose an open-top heat-sealable bag for boards packed for storage or shipment. Choose a zipper bag when the PCB must be removed repeatedly for inspection, testing or maintenance.

IC and Semiconductor Component Packaging

For IC and semiconductor components, ESD performance should be confirmed before bag size or appearance. Provide the required surface resistance, shielding specification, component or tray dimensions and sealing method.

Tongxi shielding bags can be produced with surface resistance of 108–1011 Ω, static shielding of <20 nJ and static decay of <0.03 s.

If the semiconductor product also requires a stronger moisture, oxygen and light barrier, consider an anti-static aluminum foil bag rather than relying only on a metallized shielding structure.

LED, LCD and Optoelectronic Components

For LED, LCD and optoelectronic products, consider component dimensions, ESD sensitivity, product weight and storage conditions. Custom dimensions help reduce unnecessary internal movement during transportation, while the appropriate film thickness should be selected according to product weight and handling requirements.

Custom Anti-static Shielding Bag Specifications

Tongxi can manufacture custom ESD shielding bags according to the electrical, dimensional and packaging requirements of the component. Existing drawings, packaging samples or customer specifications can be used for production matching.

Custom ESD Performance

For products with an established ESD control specification, the electrical requirements can be defined before sampling rather than selecting a bag only by material thickness.

If your IC, semiconductor device or electronic assembly requires a different acceptance value, include the target value and test method with the RFQ so the production specification can be matched before sample approval.

MOQ, Samples, Lead Time and Bulk Packing