SMD Packaging Tape Materials
Tongxi Electronics is a SMD Packaging Tape Materials manufacturer of embossed carrier tape and matched cover tape for IC, SMD, and semiconductor component packaging. Based in Zhuhai, Guangdong, we supply tape-and-reel packaging materials to electronics manufacturers and EMS providers worldwide — including recognized partnerships with tier-1 semiconductor companies such as ST Microelectronics.
Key Specifications at a Glance
| Carrier Tape | Seal Cover Tape | |
|---|---|---|
| Material | PC / PS / PET | PET-based composite |
| Width | 8mm – 88mm | 5.4mm – 37.2mm |
| Standard | EIA-481, RoHS | ASTM D882, RoHS |
| ESD Option | Surface resistivity <1×10¹¹ Ω | Surface resistivity <1×10¹¹ Ω |
| Heat Resistance (PC) | ≥85°C (0.45MPa) | Seal temp: 130°C–170°C |
| Peel Force | — | 30g–80g (adjustable) |
| Lead Time (custom) | 10–15 business days (tooling) | Standard sizes: in stock |
| Certifications | ISO 9001:2015, RoHS | ISO 9001:2015, RoHS |
Why Source Carrier Tape from Tongxi?
① Precision Pocket Formation — Zero Component MigrationOur embossed carrier tape is manufactured on automated forming lines with in-line dimensional monitoring. Pocket wall thickness uniformity is held to ±0.05mm, and cumulative pitch error is controlled to <0.2mm per 250mm — directly reducing mis-pick rates and component flipping during high-speed SMT operation.
② Matched Carrier Tape + Cover Tape SetsSourcing cover tape and carrier tape from different suppliers is a common root cause of inconsistent peel force and seal failure. Tongxi validates every cover tape lot against our carrier tape materials, pre-testing seal strength and peel force before shipment. You receive a tested, compatible set — not two independently-sourced products.
③ Custom Cavity in 10–15 Business DaysSend us your component drawing or a physical sample. Our engineering team designs the cavity geometry, produces the forming tool, and delivers sampling within 10–15 business days. Non-standard pocket shapes (multi-row, offset, irregular) are supported.
④ ESD Protection Built InAll anti-static carrier tape and cover tape variants are in-line tested for surface resistivity (<1×10¹¹ Ω), meeting ANSI/ESD S20.20 requirements. ESD-sensitive ICs, bare die, and WLCSP components can be packaged and shipped without additional protective packaging.
⑤ ISO 9001:2015 Quality System — Full TraceabilityEvery production batch carries a Certificate of Conformance (CoC). Raw material batch numbers, forming parameters, and QC inspection data are retained for full traceability. Test reports available on request.
Request a quote
Looking for a reliable carrier tape and cover tape manufacturer for semiconductor, IC, LED, electronic component, and SMT packaging applications? Our precision-engineered carrier tape and cover tape solutions are designed to provide secure component protection, accurate positioning, and stable automated feeding performance throughout the pick-and-place process. With strict quality control and customization capabilities, we help ensure efficient production and reliable component handling for demanding electronic manufacturing environments.
Contact us today to discuss your packaging requirements and receive professional technical support.
