Wafer pads are indispensable components in the semiconductor ecosystem. They act as the foundation on which wafers rest during numerous fabrication steps. The quality of the wafer pad can significantly impact the overall quality of the fabricated chips. Our wafer pads are made from materials that possess outstanding thermal stability, chemical resistance, and mechanical strength. This ensures that they can withstand the harsh environments and repetitive processes within a semiconductor cleanroom.
Material: PS
Thickness: 160±16μm
Surface resistivity: 10 5-10 9Ω/sqm
Exceptional Flatness: With a surface that is meticulously finished to achieve an extremely flat profile, our wafer pads minimize any potential warp or distortion of the wafers placed on them. This enables precise alignment of the patterns during lithography processes, resulting in more accurate and reliable integrated circuits.
Chemical Compatibility: The materials used in our wafer pads are carefully selected to be compatible with a wide range of chemicals employed in semiconductor processing, such as acids, solvents, and etchants. This compatibility prevents any unwanted reactions that could damage the wafers or affect the processing quality.
Durability: Built to last, our wafer pads can endure multiple processing cycles without degradation. Their robust construction reduces the need for frequent replacements, thereby saving costs and minimizing downtime in semiconductor production lines.
