Glass epoxy tape
PRODUCT DESCRIPTION
Information:
High Tg Glass epoxy tape material for IC Chip Mounting Features:
1. Excellent viscosity
2. Excellent in flame resistance
3. Excellent in adhesion to copper foil.
4. Excellent in insulation resistance
5.Excellent in chemical resistance
6. Cold curing (max.160° C) is possible
Epoxy film tape characteristics:
1. UL approved temperature resistance up to 155 ° C and flameproof
2. Epoxy film tape is resistant to welding, puncture resistance, thin film, high dielectric strength and good shape.
3. a wide range of functions, help reduce inventory costs
Applications:
1.IC susbstrate for Smart card.
2.IC substrate for BGA,CSP or COB
3.Substrate for small LCD
Also recommend use on: the coil; capacitor; , wire strapping
Chip package carrier tape / module package guide tape / IC chip package guide tape / smart card chip package carrier tape / smart card package guide tape
