Glass epoxy tape

Information:

High Tg Glass epoxy tape material for IC Chip Mounting  Features:
1. Excellent viscosity
2. Excellent in flame resistance
3. Excellent in adhesion to copper foil.
4. Excellent in insulation resistance
5.Excellent in chemical resistance
6. Cold curing (max.160° C) is possible

Excellent characteristics

1.Excellent viscosity: Even in complex working environments, the tape can be closely connected to the pasted object to ensure that the chip is as stable as ever under various vibration and shock conditions.

2.Excellent flame retardant: it is a reliable shield for the safe operation of electronic equipment, which can effectively reduce the risk of fire caused by circuit failure, and escort the long-term stable operation of electronic equipment.

3.Strong adhesion of copper foil: When manufacturing electronic components, it is firmly combined with copper foil to ensure stable circuit connection and greatly improve the reliability of the entire circuit system.

4.High insulation resistance: high-efficiency isolation of current, effectively prevent leakage, and provide a solid electrical guarantee for the normal operation of electronic equipment.

5.Good chemical resistance: whether it is in the face of chemical reagents in the production process or complex chemical substances in the use environment, it can maintain stable performance and significantly extend the service life of the product.

6.Cold curing advantages: It supports cold curing up to 160°C, which brings great flexibility to the production process, effectively reduces production costs and improves production efficiency.

Advantages of epoxy film tape：

UL certification, temperature resistance and fire resistance: Through UL certification, the temperature resistance is as high as 155°C, it has fire resistance, and it can function stably in high temperature environments.

Excellent mechanical and electrical properties: welding resistance, puncture resistance, can withstand all kinds of mechanical stress and thermal stress in the manufacturing process of electronic components; thin film, does not take up too much space, high dielectric strength, to ensure good electrical insulation properties.

Shape adaptability and wide range of functions: good shape adaptability, convenient for precise pasting and use on electronic components of various complex shapes; wide range of functions, helping to reduce inventory costs.

Wide range of applications：

Smart card related: It is an ideal bonding material for the IC interface of smart cards, which provides a stable connection for the efficient operation of smart cards; it performs well in the carrier tape of smart card chip packaging and the guide tape of smart card packaging.

IC carrier board: In the field of BGA, CSP or COB IC carrier board, ensure a stable connection between the chip and the carrier board to improve the chip work efficiency.

Display substrate:It is a reliable choice for small liquid crystal display substrates to ensure clear display and stable operation of the display screen.

Other recommended applications: It is also recommended for strapping coils and capacitors, as well as chip packaging carrier tape, module packaging guide tape, and IC chip packaging guide tape.